Chiplet and packaging expert needed
We are seeking a part-time consultant with hands-on experience in advanced packaging, chiplet integration, and shared wafer processes. The ideal candidate will have a deep understanding of multi-die architectures, interconnect strategies, and collaborative wafer utilization to optimize performance, yield, and cost. The initial engagement will be advisory, providing expertise and guidance on an as-needed basis, with the potential for deeper involvement over time.
Keyword: Design Expert
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